U.S. launches $3B effort to boost advanced chip packaging

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One thought on “U.S. launches $3B effort to boost advanced chip packaging

  1. There’s been a lot of talk in Indiana about semiconductor packaging, which is a lot more complicated than it sounds. People from Indiana’s C-Suite have made at least 3 visits to Indiana YTD. With talks of a $50B semiconductor plant coming to Indiana or “one other state” and the closest packaging to Intel’s new Columbus fab being in New Mexico, I think that Intel is trying to decide between Indiana and Ohio for its next facility in the Midwest. We’ll see.

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